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Gold wire 0.025
Price: Gold wire 0,025 mm
1 gram = 100 meters
1 kg = 100 000 meters
Purity: 99,99% (specification IGAS GmbH Goslar, German)
Quantity: Approx 1kg ~ 100 000 meters/weeks, or more
Gold wire 0,025 mm - 99.99 purity - WJC2,WJC5,WJE1
Gold wire 0,025 mm (0,001 in, 50 gauge) / 99.99 purity
Gold bonding wire is a kind of material for inner lead with excellent electrical conductivity, mechanical properties, curvature, breaking force and excellent chemical stability. It functions primarily as a connecting material for chip and external circuit, widely used in LED packing and IC packaging and other microelectronics industries.
Specification: Golg wire 0,025 mm
Type Gold Wire for use:
WJC2: SOT, SOP, DIP, LED
WJC5: SOP, DIP, QFP, Diode, Triode
WJE1: QFP, BGA, USW
SOP (Standard Operating Procedure), SOT (Surface Mount Technology, DIP (Dual In line Package)
QFP (Quad Flat Package), BGA (Ball Grid Array), USW (Utrafine Spacing Welding)
Features of products:
1.diameter:
mm 0,014 0,015 0,016 0,017 0,018 0,019 0,020
mil 0,5 0,6 0,6 0,65 0,70 0,75 0,90
mm 0,023 0,025 0,028 0,030 0,032 0,033 0,038
mil 0,95 1 1,1 1,2 1,25 1,3 1,4
2. high purity: Au 99.99
Impurity contenc (ppm)
Au - content of not less than Ag Fe Pd Mg Cu Si Others Total
99.99 ≤ 15 ≤ 5
≤ 10
≤ 5
≤ 15
≤ 10
≤ 40
≤ 100
Certificates - standard document "Golg wire "
1 gram = 100 meters
1 kg = 100 000 meters
Purity: 99,99% (specification IGAS GmbH Goslar, German)
Quantity: Approx 1kg ~ 100 000 meters/weeks, or more
Gold wire 0,025 mm - 99.99 purity - WJC2,WJC5,WJE1
Gold wire 0,025 mm (0,001 in, 50 gauge) / 99.99 purity
Gold bonding wire is a kind of material for inner lead with excellent electrical conductivity, mechanical properties, curvature, breaking force and excellent chemical stability. It functions primarily as a connecting material for chip and external circuit, widely used in LED packing and IC packaging and other microelectronics industries.
Specification: Golg wire 0,025 mm
Type Gold Wire for use:
WJC2: SOT, SOP, DIP, LED
WJC5: SOP, DIP, QFP, Diode, Triode
WJE1: QFP, BGA, USW
SOP (Standard Operating Procedure), SOT (Surface Mount Technology, DIP (Dual In line Package)
QFP (Quad Flat Package), BGA (Ball Grid Array), USW (Utrafine Spacing Welding)
Features of products:
1.diameter:
mm 0,014 0,015 0,016 0,017 0,018 0,019 0,020
mil 0,5 0,6 0,6 0,65 0,70 0,75 0,90
mm 0,023 0,025 0,028 0,030 0,032 0,033 0,038
mil 0,95 1 1,1 1,2 1,25 1,3 1,4
2. high purity: Au 99.99
Impurity contenc (ppm)
Au - content of not less than Ag Fe Pd Mg Cu Si Others Total
99.99 ≤ 15 ≤ 5
≤ 10
≤ 5
≤ 15
≤ 10
≤ 40
≤ 100
Certificates - standard document "Golg wire "
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